AMIS-30660 Datasheet, PDF(11/11 Page) AMI SEMICONDUCTOR

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AMIS-30660 High Speed CAN Transceiver

Data Sheet

Suitability of surface mount IC packages for wave and reflow soldering methods

Package

BGA, SQFP

HLQFP, HSQFP,

HSOP, HTSSOP, SMS

PLCC (3) , SO, SOJ

LQFP, QFP, TQFP

SSOP, TSSOP, VSO

Soldering Method

Wave

Not suitable

Not suitable (2)

Suitable

Not recommended (3)(4)

Not recommended (5)

Reflow (1)

Suitable

Notes

1. All surface mount (SMD) packages are moisture sensitive.

Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the

package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them

(the so called popcorn effect). For details, refer to the

Drypack information in the âData Handbook IC26; Integrated

Circuit Packages; Section: Packing Methodsâ.

2. These packages are not suitable for wave soldering as a

solder joint between the printed-circuit board and heatsink (at

bottom version) can not be achieved, and as solder may stick

to the heatsink (on top version).

3. If wave soldering is considered, then the package must be

placed at a 45Âº angle to the solder wave direction. The

package footprint must incorporate solder thieves downstream

and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP

packages with a pitch (e) equal to or larger than 0.8mm; it is

definitely not suitable for packages with a pitch (e) equal to

or smaller than 0.65mm.

5. Wave soldering is only suitable for SSOP and TSSOP

packages with a pitch (e) equal to or larger than 0.65mm; it is

definitely not suitable for packages with a pitch (e) equal to

or smaller than 0.5mm.

Revision Number

Version 1

Revision 1.1

Revision 1.2

Changes on page

1 and 6

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