EY1501DI-ADJ Datasheet, PDF (11/13 Pages) Altera Corporation – EY1501DI-ADJ High Performance 1A LDO

Page 11
The DFN package uses the copper area on the PCB as a heat-sink. The EPAD of this package must be soldered to the
copper plane (GND plane) for effective heat dissipation. Figure 16 shows a curve for the θ_JA of the DFN package for
different copper area sizes.
49
47
45
43
41
39
37
2 4 6 8 10 12 14 16 18 20 22 24
EPAD-MOUNT COPPER LAND AREA ON PCB, mm²
FIGURE 16. 3MMX3MM-10 PIN DFN ON 4-LAYER PCB WITH THERMAL
VIAS θ_JA VS EPAD-MOUNT COPPER LAND AREA ON PCB
Thermal Fault Protection
The power level and the thermal impedance of the package (+45°C/W for DFN) determine when the junction temperature
exceeds the thermal shutdown temperature. In the event that the die temperature exceeds around +160°C, the output of the
LDO will shut down until the die temperature cools down to about +130°C.
Current Limit Protection
The EY1501DI-ADJ LDO incorporates protection against overcurrent due to any short or overload condition applied to the
output pin. The LDO performs as a constant current source when the output current exceeds the current limit threshold
noted in the “Electrical Specifications” table on page 4. If the short or overload condition is removed from V_OUT, then the
output returns to normal voltage regulation mode. In the event of an overload condition, the LDO may begin to cycle on
and off due to the die temperature exceeding thermal fault condition and subsequently cooling down after the power
device is turned off.
May 2014 Altera Corporation
10039
Enpirion Power Datasheet EY1501DI-ADJ High Performance 1A LDO
May 28, 2014
Rev A