MT48LC4M32B2TG-6A Datasheet, PDF (12/79 Pages) Alliance Semiconductor Corporation – MT48LC4M32B2 – 1 Meg x 32 x 4 Banks

Package Dimensions
Figure 4: 86-Pin Plastic TSOP II (400 mil) – Package Codes TG/P
22.22 ±0.08
0.50
TYP
0.20
+0.07
-0.03
0.61
2X 0.10
2X 2.80
11.76 ±0.20
10.16 ±0.08
128Mb: x32 SDRAM
Package Dimensions
See Detail A
Pin #1 ID
2X R 0.75
2X R 1.00
0.15
+0.03
-0.02
0.25
0.10
1.20 MAX
Plated lead finish:
TG (90% Sn, 10% Pb) or P (100% Sn) 0.01 ±0.005 thick per side
Plastic package material: Epoxy novolac
Package width and length do not include
mold protrusion. Allowable protrusion is
0.25 per side.
0.10
+0.10
-0.05
0.50 ±0.10
Detail A
Gage
plane
0.80
TYP
Notes:
1. All dimensions are in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
0.25mm per side.
3. "2X" means the notch is present in two locations (both ends of the device).
4. Package may or may not be assembled with a location notch.
PDF: 09005aef80872800
128mb_x32_sdram.pdf - Rev. V 03/16 EN
12
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