AK4160 Datasheet, PDF (38/40 Pages) Asahi Kasei Microsystems – 16-channel Capacitive Touch Sensor IC

28pin QFN (Unit: mm)
Top View
B
PACKAGE
[AK4160]
0.75±0.05
Bottom View
22
21
2.30±0.10
28
C0.3
1
A
4.00±0.05
0.05MAX
15
14
0.18±0.05
7
8
0.07M ^{C A B}
0.08 C
C
0.40 Ref
Note: The thermal die pad must be open or connected to the ground.
■ Package & Lead frame material
Package molding compound: Epoxy Resin, Halogen (Br, Cl) Free
Lead frame material: Cu Alloy
Lead frame surface treatment: Solder Plate
MS1313-E-01
- 38 -
2011/11