AK4551 Datasheet, PDF (14/15 Pages) Asahi Kasei Microsystems – LOW POWER & SMALL PACKAGE 20BIT CODEC

ASAHI KASEI
PACKAGE
16pin TSSOP (Unit: mm)
*5.0
16
9
A
[AK4551]
1.10max
1
0.22±0.1
8
0.65
Detail A
Seating Plane
0.10
NOTE: Dimension "*" does not include mold flash.
n Package & Lead frame material
Package molding compound:
Lead frame material:
Lead frame surface treatment:
Epoxy
Cu
Solder plate
0.17±0.05
0.1±0.1
0-10°
MS0029-E-00
- 14 -
2000/5