DAC8420 Datasheet, PDF (4/16 Pages) Analog Devices – Quad 12-Bit Serial Voltage Output DAC

DAC8420
WAFER TEST LIMITS (at VDD = +15.0 V, VSS = –15.0 V, VREFHI = +10.0 V, VREFLO = –10.0 V, TA = +25؇C
unless otherwise noted)
Parameter
Symbol
Conditions
DAC8420G
Limit
Units
Integral Linearity
Differential Linearity
Min-Scale Offset
Max-Scale Offset
Logic Input High Voltage
Logic Input Low Voltage
Logic Input Current
Positive Supply Current
Negative Supply Current
INL
DNL
V_INH
V_INL
I_IN
I_DD
I_SS
±1
LSB max
±1
LSB max
±1
LSB max
±1
LSB max
2.4
V min
0.8
V max
1
µA max
8
mA max
7
mA max
NOTE
Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.
ABSOLUTE MAXIMUM RATINGS
(T_A = +25°C unless otherwise noted)
V_DD to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +18.0 V
V_SS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V, –18.0 V
V_SS to V_DD . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +36.0 V
V_SS to V_VREFLO . . . . . . . . . . . . . . . . . . . . . . –0.3 V, V_SS – 2.0 V
V_VREFHI to V_VREFLO . . . . . . . . . . . . . . . . . . . +2.0 V, V_DD – V_SS
V_VREFHI to V_DD . . . . . . . . . . . . . . . . . . . . . . . +2.0 V, +33.0 V
I_VREFHI, I_VREFLO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 mA
Digital Input Voltage to GND . . . . . . . . . –0.3 V, V_DD + 0.3 V
Output Short Circuit Duration . . . . . . . . . . . . . . . . Indefinite
Operating Temperature Range
EP, FP, ES, FS, EQ, FQ . . . . . . . . . . . . . . –40°C to +85°C
Dice Junction Temperature . . . . . . . . . . . . . . . . . . . . . +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +150°C
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . 1000 mW
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . . +300°C
3. Remove power before inserting or removing units from their
sockets.
4. Analog Outputs are protected from short circuits to ground
or either supply.
DICE CHARACTERISTICS
(SUBSTRATE)
VOUTD _VDD CLSEL
2
1
16
CLR
15
14 LD
13 NC
Package Type
16-Pin Plastic DIP (P)
16-Pin Hermetic DIP (Q)
16-Lead Small Outline
Surface Mount (S)
Thermal Resistance
θ_JA
θ_JC
70¹
27
82¹
9
86²
22
Units
°C/W
°C/W
°C/W
NOTES
1_{θJA is specified for worst case mounting conditions, i.e., θJA is specified for}
device in socket.
2_{θJA is specified for device on board.}
VOUTC 3
VREFLO 4
VREFHI 5
VOUTB 6
CAUTION
1. Stresses above those listed under “Absolute Maximum Rat-
ings” may cause permanent damage to the device. This is a
stress rating only and functional operation at or above this
specification is not implied. Exposure to the above maximum
rating conditions for extended periods may affect device
reliability.
2. Digital inputs and outputs are protected, however, permanent
damage may occur on unprotected units from high-energy
electrostatic fields. Keep units in conductive foam or packaging
at all times until ready to use. Use proper antistatic handling
procedures.
12 CS
11 CLK
7
89
10
VOUTA VSS GND
SDI
NC = NO CONNECT
Die Size 0.119 × 0.283 inch, 33,677 sq. mils
(3.023 × 7.188 mm, 21.73 sq. mm)
Transistor Count 2,207
For additional DICE ordering information, refer to databook.
–4–
REV. 0