DAC8426 Datasheet, PDF (3/12 Pages) Analog Devices – Quad 8-Bit Voltage Out CMOS DAC Complete with Internal 10 V Reference

DAC8426
ABSOLUTE MAXIMUM RATINGS
V_DD to AGND or DGND . . . . . . . . . . . . . . . . . –0.3 V, +17 V
V_SS to AGND or DGND . . . . . . . . . . . . . . . . . . . . . –7 V, V_DD
V_DD to V_SS . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +24 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +5 V
Digital Input Voltage to DGND . . . . . . . . . . . . . –0.3 V, V_DD
V_REFOUT to AGND¹ . . . . . . . . . . . . . . . . . . . . . –0.3 V, V_DD
V_OUT to AGND¹ . . . . . . . . . . . . . . . . . . . . . . . . . . . . V_SS, V_DD
Operating Temperature
Military AR/BR . . . . . . . . . . . . . . . . . . . . –55°C to +125°C
Extended Industrial ER/EP/FR/FP/FS . . . . –40°C to +85°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300°C
THERMAL RESISTANCE
Package Type
␪_JA2
20-Pin Cerdip (R)
70
20-Pin Plastic DIP (P) 61
20-Pin SOL(S)
80
␪_JC
Units
7
°C/W
24
°C/W
22
°C/W
NOTES
1_{Outputs may be shorted to any terminal provided the package power dissipation}
is not exceeded. Typical output short-circuit current to AGND is 50 mA.
2_{θJA is specified for worst case mounting conditions, i.e., θJA is specified for de-}
vice in socket for cerdip and P-DIP packages; θ_JA is specified for device sol-
dered to printed circuit board for SOL package.
CAUTION
1. Do not apply voltages higher than V_DD or less than V_SS po-
tential on any terminal.
2. The digital control inputs are zener-protected; however,
permanent damage may occur on unprotected units from
high-energy electrostatic fields. Keep units in conductive
foam at all times until ready to use.
3. Do not insert this device into powered sockets. Remove
power before insertion or removal.
4. Stresses above those listed under “Absolute Maximum Rat-
ings” may cause permanent damage to device.
PIN CONNECTIONS
20-Pin Cerdip
(R Suffix)
20-Pin Epoxy DIP
(P Suffix)
20-Pin SOL
(S Suffix)
ORDERING GUIDE¹
Model
Total Unadjusted Error
Temperature Range
Package Description
DAC8426AR²
DAC8426ER
DAC8426EP
DAC8426BR²
DAC8426FR
DAC8426FP
DAC8426FS³
± 1 LSB
± 1 LSB
± 1 LSB
± 2 LSB
± 2 LSB
± 2 LSB
± 2 LSB
–55°C to +125°C
–40°C to +85°C
–40°C to +85°C
–55°C to +125°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
NOTES
1_{Burn-in is available on commercial and industrial temperature range parts in cerdip, plastic DIP, and TO-can packages.}
2_{For devices processed in total compliance to MIL-STD-883, add /883 after part number. Consult factory for 883 data sheet.}
3_{For availability and burn-in information on SO and PLCC packages, contact your local sales office.}
20-Pin Cerdip (Q-20)
20-Pin Cerdip (Q-20)
20-Pin Plastic DIP (N-20)
20-Pin Cerdip (Q-20)
20-Pin Cerdip (Q-20)
20-Pin Plastic DIP (N-20)
20-Lead SOL (R-20)
REV. C
Burn-In Circuit
–3–