HMC6301 Datasheet, PDF (24/24 Pages) Analog Devices – Programmable baseband gain and filter bandwidth

HMC6301
Data Sheet
OUTLINE DIMENSIONS
BALL A1
IDENTIFIER
0.815
0.755
0.695
SEATING
PLANE
6.050
6.000
5.950
TOP VIEW
(BALL SIDE DOWN)
SIDE VIEW
0.310
0.270
0.230
4.050
4.000
3.950
3.50
REF
0.50
BSC
0.25
BSC
0.595
0.565
0.535
COPLANARITY
0.10
0.220
0.190
0.160
12 11 10 9 8 7 6 5 4 3 2 1
0.15
0.485
0.65
0.25
0.635
0.40 BSC
0.50 BSCB(B^OA^TL^TL^OS^MIDE^VU^IEP^W)
0.25 BSC
5.50 REF
5.75 REF
A
B
C
D
E
F
GROUND
G ^AREA
H
Figure 22. 75-Ball Wafer Level Ball Grid Array [WLBGA]
(BF-75-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature
Range
HMC6301BG46
−40°C to +85°C
Chip Bump Composition
96.5 Tin (Sn), 3.0 Silver (Ag),
0.5 Copper (Cu)
MSL
Rating¹
MSL1
Package Description
75-Ball WLBGA
EV1HMC6301BG46
EK1HMC6350
Evaluation Board, PCB Only
Evaluation Kit Assembly
Package
Option
BF-75-1
Package Marking²
BBFZ
#YYWW
XXX XXXXX-XX
1 _{Maximum peak reflow temperature of 260°C. The peak reflow temperature must not exceed the maximum temperature for which the package is qualified according}
to the moisture sensitivity level (MSL1).
2 _{BBFZ indicates a Pb-free part, #YYWW indicates the year and week number, and the assembly lot number is indicated by XXX XXXXXX-XX.}
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D14424-0-9/16(A)
Rev. A | Page 24 of 24