SSM2932 Datasheet, PDF (15/16 Pages) Analog Devices – High Efficiency, Ground-Referenced

Data Sheet
OUTLINE DIMENSIONS
BALL A1
IDENTIFIER
0.560
0.500
0.440
SEATING
PLANE
1.680
1.640 SQ
1.600
TOP VIEW
(BALL SIDE DOWN)
1.20
REF
0.40
REF
4321
A
B
C
D
BOTTOM VIEW
(BALL SIDE UP)
SIDE VIEW
0.300
0.260
0.220
COPLANARITY
0.05
0.230
0.200
0.170
Figure 31. 16-Ball Wafer Level Chip Scale Package [WLCSP]
1.6 mm × 1.6 mm Body
(CB-16-11)
Dimensions shown in millimeters
ORDERING GUIDE
Model¹
SSM2932ACBZ-RL
SSM2932ACBZ-R7
EVAL-SSM2932Z
1 _{Z = RoHS Compliant Part.}
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
16-Ball Wafer Level Chip Scale Package [WLCSP]
16-Ball Wafer Level Chip Scale Package [WLCSP]
Evaluation Board
SSM2932
Package Option
CB-16-11
CB-16-11
Rev. 0 | Page 15 of 16