SSM2932 Datasheet, PDF (13/16 Pages) Analog Devices – High Efficiency, Ground-Referenced

Data Sheet
In addition, good PCB layout isolates critical analog paths from
sources of high interference. High frequency circuits (analog
and digital) should be separated from low frequency circuits.
Properly designed multilayer PCBs can reduce EMI emissions
and increase immunity to the RF field by a factor of 10 or more
compared with double-sided boards. A multilayer board allows
a complete layer to be used for the ground plane, whereas the
ground plane side of a double-sided board is often disrupted by
signal crossover.
SSM2932
If the system has separate analog and digital ground and power
planes, the analog ground plane should be directly beneath the
analog power plane, and, similarly, the digital ground plane should
be directly beneath the digital power plane. There should be no
overlap between analog and digital ground planes or between
analog and digital power planes.
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