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RT3PE3000L-1FG484B Datasheet, PDF (1/144 Pages) Actel Corporation – Radiation-Tolerant ProASIC3 Low-Power Space- Flight Flash FPGAs | |||
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Advance v0.1
Radiation-Tolerant ProASIC3 Low-Power Space-
®
Flight Flash FPGAs
with Flash*Freeze Technology
Features and Benefits
MIL-STD-883 Class B Qualified Packaging
⢠Ceramic Column Grid Array with Six Sigma Copper-
Wrapped Lead-Tin Columns
⢠Land Grid Array
Low Power
⢠Dramatic Reduction in Dynamic and Static Power
⢠1.2 V to 1.5 V Core and I/O Voltage Support for Low
Power
⢠Low Power Consumption in Flash*Freeze Mode Enables
Instantaneous Entry To / Exit From Low-Power
Flash*Freeze Mode
⢠Supports Single-Voltage System Operation
⢠Low-Impedance Switches
Radiation Tolerant
⢠15 krad Total Ionizing Dose (TID)
⢠Wafer-Lot-Specific TID Reports
High Capacity
⢠600 k to 3 M System Gates
⢠Up to 504 kbits of True Dual-Port SRAM
⢠Up to 620 User I/Os
Reprogrammable Flash Technology
⢠130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
Process
⢠Live-at-Power-Up (LAPU) Level 0 Support
⢠Single-Chip Solution
⢠Retains Programmed Design when Powered Off
⢠High-Performance, Low-Skew Global Network
⢠Architecture Supports Ultra-High Utilization
Advanced and Pro (Professional) I/Os
⢠700 Mbps DDR, LVDS-Capable I/Os
⢠1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage
Operation
⢠Bank-Selectable I/O Voltagesâup to 8 Banks per Chip
⢠Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /
2.5 V / 1.8 V / 1.5 V / 1.2 V, 3.3 V PCI / 3.3 V PCI-X, and
LVCMOS 2.5 V / 5.0 V Input
⢠Differential I/O Standards: LVPECL, LVDS, B-LVDS, and M-LVDS
⢠Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL
2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3
Class I and II (RT3PE3000L only)
⢠I/O Registers on Input, Output, and Enable Paths
⢠Hot-Swappable and Cold-Sparing I/Os
⢠Programmable Output Slew Rate and Drive Strength
⢠Programmable Input Delay (RT3PE3000L only)
⢠Schmitt Trigger Option on Single-Ended Inputs
(RT3PE3000L)
⢠Weak Pull-Up/-Down
⢠IEEE 1149.1 (JTAG) Boundary Scan Test
⢠Pin-Compatible Packages across the Radiation-Tolerant
ProASIC®3 Family
Clock Conditioning Circuit (CCC) and PLL
⢠Six CCC Blocks, All with Integrated PLL (RT ProASIC3)
⢠Configurable Phase Shift, Multiply/Divide, Delay
Capabilities, and External Feedback
High Performance
⢠350 MHz (1.5 V) and 250 MHz (1.2 V) System Performance
⢠3.3 V, 66 MHz, 66-Bit PCI (1.5 V); 66 MHz, 32-Bit PCI (1.2 V)
In-System Programming (ISP) and Security
⢠Secure ISP Using On-Chip 128-Bit Advanced Encryption
Standard (AES) Decryption via JTAG (IEEE 1532âcompliant)
⢠FlashLock® to Secure FPGA Contents
High-Performance Routing Hierarchy
⢠Segmented, Hierarchical Routing and Clock Structure
⢠Wide Input Frequency Range 1.5 MHz to 250 MHz (1.2 V
systems) and 350 MHz (1.5 V systems)
SRAMs and FIFOs
⢠Variable-Aspect-Ratio 4,608-Bit RAM Blocks (Ã1, Ã2, Ã4,
Ã9, and Ã18 organizations available)
⢠True Dual-Port SRAM (except Ã18)
⢠24 SRAM and FIFO Blocks with Synchronous Operation:
â 250 MHz: For 1.2 V Systems
â 350 MHz: For 1.5 V Systems
Table I-1 ⢠Radiation-Tolerant (RT) ProASIC3 Low-Power Space-Flight FPGAs
RT ProASIC3 Devices
RT3PE600L
RT3PE3000L
System Gates
600 k
3M
VersaTiles (D-flip-flops)
13,824
75,264
RAM kbits (1,024 bits)
108
504
4,608-Bit Blocks
24
112
FlashROM Bits
1k
1k
Secure (AES) ISP
Yes
Yes
Integrated PLL in CCCs
6
6
VersaNet Globals
18
18
I/O Banks
8
8
Maximum User I/Os
270
620
Package Pins
CCGA/LGA
CG/LG484
CG/LG484, CG/LG896
September 2008
I
© 2008 Actel Corporation
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