THS6182_08 Datasheet, PDF (6/35 Pages) Texas Instruments – LOW-POWER DISSIPATION ADSL LINE DRIVER

THS6182
SLLS544H – SEPTEMBER 2002 – REVISED JUNE 2007
R_G 750 Ω
CODEC
V_IN+
+18 V
−
+ _THS6182a
4.87 _Ω
R_G 1.33 kW
1 kW
1 kW
1:1.6
20-dBm
Line
Power
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100 Ω
CODEC
V_IN−
R_F 750 _Ω
+18 V
−
+ _THS6182b
4.87 Ω
Figure 1. Single-Supply ADSL CO Line Driver Circuit Utilizing Active Impedance (SF = 4)
PIN ASSIGNMENTS
THS6182
SOIC−20 (DW) AND
SOIC−20 PowerPAD™ (DWP) PACKAGES
(TOP VIEW)
THS6182
SOIC−16 (D) PACKAGE
(TOP VIEW)
THS6182
Leadless 24−pin PowerPAD™
4 mm X 5 mm (RHF) PACKAGE
(TOP VIEW)
D1 IN− 1
D1 OUT 2
VCC − 3
GND 4
GND 5
GND 6
GND 7
D1 IN+ 8
BIAS−2 9
BIAS−1 10
20 D2 IN−
19 D2 OUT
18 VCC +
17 GND
16 GND
15 GND
14 GND
13 D2 IN+
12 IADJ
11 N/C
D1 IN− 1
D1 OUT 2
V _CC − 3
GND 4
GND 5
D1 IN+ 6
BIAS−2 7
BIAS−1 8
16 D2 IN−
15 D2 OUT
14 VCC +
13 GND
12 GND
11 D2 IN+
10 IADJ
9 N/C
N/C
N/C
VCC−
N/C
N/C
N/C
GND
24 23 22 21 20
1
19
2
18
3
17
Power
4
PAD ^TM
16
5
15
6
14
7
13
8 9 10 11 12
N/C
N/C
VCC+
N/C
N/C
N/C
GND
A. The PowerPAD is electrically isolated from all active circuity and pins. Connection of the PowerPAD to the PCB
ground plane is highly recommended, although not required, as this plane is typically the largest copper plane on a
PCB. The thermal performance will be better with a large copper plane than a small one.
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