W971GG8JB_12 Datasheet, PDF (86/87 Pages) Winbond – 16M x 8 BANKS x 8 BIT DDR2 SDRAM

W971GG8JB
12. PACKAGE SPECIFICATION
Package Outline WBGA60 (8x12.5 mm²)
eE
987
E1
321
A
A1
bbb C
Pin A1 index
Pin A1 index
A
B
C
D
E
F
G
H
J
K
L
aaa
E
B
A
60xΦb
THE WINDOW-SIDE
ENCAPSULANT
SOLDER BALL DIAMETER REFERS.
TO POST REFLOW CONDITION.
SYMBOL
A
A1
b
D
E
D1
E1
eE
eD
aaa
bbb
ccc
DIMENSION (MM)
MIN.
---
NOM.
---
MAX.
1.20
0.25
---
0.40
0.40
0.45
0.50
12.40 12.50 12.60
7.90
8.00
8.10
8.00 BSC.
6.40 BSC.
0.80 BSC.
0.80 BSC.
---
---
0.15
---
---
0.20
---
---
0.10
ccc C
C
SEATING PLANE
Ball Land
Ball Opening
Note: 1. Ball land : 0.5mm
2. Ball opening : 0.4mm
3. PCB Ball land suggested ≤ 0.4mm
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Publication Release Date: Jun. 15, 2012
Revision A02