W55RFS27T3B Datasheet, PDF (8/16 Pages) Winbond – SUPER-REGENERATION RF RECEIVER

W55RFS27T3B
3.3 W55RFS27T3B Ordering Information
The W55RFS27T3B is available in two forms: Dice form and Wafer form
PART NUMBER
W55RFS27T3B(H)
W55RFS27T3B(W)
PACKAGE
Dice form
Wafer form
REMARKS
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3.4 W55RFS27T3B Package Information
3.4.1 Bonding Pad List
Window : (xl = -620.000, yl = -635.000),(xh = 620.000, yh = 635.000)
Windows size : Width = 1240.000, length = 1270.000
=============================================================================
PAD NO
PAD NAME PIN NAME
X
Y
----------------------------------------------------------------------------------------------------------------------------------------
1
S3
1
-535.000
-69.260
2
S4
2
-535.000
-360.520
3
CKSEL0
3
-535.000
-484.865
4
TEST
4
66.325
-550.000
5
CKSEL1
5
173.325
-550.000
6
ANT
6
282.725
-550.000
7
* VSS
*7
535.000
-218.395
8
VDD
8
535.000
20.945
9
RESET
9
535.000
284.600
10
X1
10
245.005
550.000
11
X2
11
138.005
550.000
12
ID1
12
31.005
550.000
13
ID0
13
-75.995
550.000
14
TXOUT
14
-288.420
550.000
15
S1
15
-535.000
329.000
16
S2
16
-535.000
37.740
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(*: Bonding Sequence start from VSS(Pin7))
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