W55RFS27T3B Datasheet, PDF (1/16 Pages) Winbond – SUPER-REGENERATION RF RECEIVER

W55RFS27T3B DATA SHEET
SUPER-REGENERATION RF RECEIVER
Table of Content-
1. GENERAL DESCRIPTION ......................................................................................................... 2
1.1 Features............................................................................................................................. 2
1.2 W55RFS27T3B Pad Definition .......................................................................................... 3
1.2.1 Pad Description ................................................................................................................3
1.2.2 Clock Frequency Select (CKSEL) Setup ..........................................................................3
1.2.3 ID Setup ...........................................................................................................................4
1.2.4 Baseband Encoder Control Function Description .............................................................4
2. SYSTEM DESCRIPTION............................................................................................................ 5
2.1 W55RFS27T3B System Block Diagram ............................................................................ 5
2.2 W55RFS27T3B Functional Description............................................................................. 6
3. ELECTRONIC CHARACTERISTICS.......................................................................................... 7
3.1 W55RFS27T3B Absolute Maximum Ratings..................................................................... 7
3.2 W55RFS27T3B DC Characteristics .................................................................................. 7
3.3 W55RFS27T3B Ordering Information ............................................................................... 8
3.4 W55RFS27T3B Package Information ............................................................................... 8
3.4.1 Bonding Pad List ..............................................................................................................8
3.4.2 Bonding Pad Diagram ......................................................................................................9
4. DESIGN INFORMATION .......................................................................................................... 10
4.1 W55RFS27T3B Reference Design.................................................................................. 10
4.1.1 TXOUT waveform...........................................................................................................10
4.1.2 Application Circuit for 6 Control Functions......................................................................11
4.1.3 Application Circuit for 4 Control Functions......................................................................12
4.2 uC-Mode Control Signal .................................................................................................. 14
4.3 W55RFS27T Family FCC Certification............................................................................ 15
5. REVISION HISTORY ................................................................................................................ 16
Publication Release Date:June 8, 2005
-1-
Revision A1