W24258-LL Datasheet, PDF (8/10 Pages) Winbond – 32K X 8 CMOS STATIC RAM

W24258/LL
PACKAGE DIMENSIONS
28-pin P-DIP
28
E1
1
S
A A2
L
D
15
B
e1
B1
14
E
A1 _{Base Plane}
Seating Plane
a
eA
Dimension in Inches Dimension in mm
Symbol _{Min. Nom. Max. Min. Nom. Max.}
A
0.210
5.33
A1
0.010
0.25
A2
0.150 0.155 0.160 3.81 3.94 4.06
B
0.016 0.018 0.022 0.41 0.46 0.56
B1
0.058 0.060 0.064 1.47 1.52 1.63
c
0.008 0.010 0.014 0.20 0.25 0.36
D
1.460 1.470
37.08 37.34
E
0.590 0.600 0.610 14.99 15.24 15.49
E1
0.540 0.545 0.550 13.72 13.84 13.97
e1
0.090 0.100 0.110 2.29 2.54 2.79
L
0.120 0.130 0.140 3.05 3.30 3.56
a
0
15
0
15
eA
0.630 0.650 0.670 16.00 16.51 17.02
S
0.090
2.29
Notes:
1. Dimensions D Max. & S include mold flash or
tie bar burrs.
2. Dimension E1 does not include interlead flash.
c
3. Dimensions D & E1 include mold mismatch and
are determined at the mold parting line.
4. Dimension B1 does not include dambar
protrusion/intrusion. .
5. Controlling dimension: Inches.
6. General appearance spec. should be based on
final visual inspection spec.
28-pin SOP Wide Body
28
15
e1
E HE
θ
L
Detail F
1
14
b
D
A2 A
S
e
y
A1
Seating Plane
e1
c
LE
See Detail F
Symbol
A
A1
A2
b
c
D
E
e
HE
L
LE
S
y
θ
Dimension in Inches
Min. Nom. Max.
0.112
Dimension in mm
Min. Nom. Max.
2.85
0.004
0.10
0.093 0.098 0.103 2.36 2.49 2.62
0.014 0.016 0.020 0.36 0.41 0.51
0.008 0.010 0.014 0.20 0.25 0.36
0.713 0.733
18.11 18.62
0.326 0.331 0.336 8.28 8.41 8.53
0.044 0.050 0.056 1.12 1.27 1.42
0.453 0.465 0.477 11.51 11.81 12.12
0.028 0.036 0.044 0.71 0.91 1.12
0.059 0.067 0.075
0.047
1.50
1.70
1.91
1.19
0.004
0.10
0
10
0
10
Notes:
1. Dimensions D Max. & S include mold flash
or tie bar burrs.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Dimensions D & E in. clude mold mismatch
and determined at the mold parting line.
4. Controlling dimension: Inches.
5. General appearance spec should be based
on final visual inspection spec.
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