W25Q64DW Datasheet, PDF (75/82 Pages) Winbond – 1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

12. PACKAGE SPECIFICATION
12.1 8-Pin SOIC 208-mil (Package Code SS)
W25Q64DW
GAUGE PLANE
SYMBOL
A
A1
A2
b
C
D
D1
E
E1
e⁽²⁾
H
L
y
θ
MILLIMETERS
Min
1.75
0.05
1.70
0.35
0.19
5.18
5.13
5.18
5.13
7.70
0.50
---
0°
Nom
1.95
0.15
1.80
0.42
0.20
5.28
5.23
5.28
5.23
1.27 BSC.
7.90
0.65
---
---
Max
2.16
0.25
1.91
0.48
0.25
5.38
5.33
5.38
5.33
8.10
0.80
0.10
8°
Min
0.069
0.002
0.067
0.014
0.007
0.204
0.202
0.204
0.202
0.303
0.020
---
0°
INCHES
Nom
0.077
0.006
0.071
0.017
0.008
0.208
0.206
0.208
0.206
0.050 BSC.
0.311
0.026
---
---
Max
0.085
0.010
0.075
0.019
0.010
0.212
0.210
0.212
0.210
0.319
0.031
0.004
8°
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
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Publication Release Date: January 13, 2011
Preliminary - Revision C