W25Q64DW Datasheet, PDF (4/82 Pages) Winbond – 1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

W25Q64DW
10.2.40 Enable QPI (38h) ..............................................................................................................65
10.2.41 Disable QPI (FFh) .............................................................................................................66
10.2.42 Enable Reset (66h) and Reset (99h) ................................................................................67
11. ELECTRICAL CHARACTERISTICS .............................................................................................. 68
11.1 Absolute Maximum Ratings................................................................................................ 68
11.2 Operating Ranges .............................................................................................................. 68
11.3 Power-up Timing and Write Inhibit Threshold .................................................................... 69
11.4 DC Electrical Characteristics.............................................................................................. 70
11.5 AC Measurement Conditions ............................................................................................. 71
11.6 AC Electrical Characteristics .............................................................................................. 72
11.7 AC Electrical Characteristics (cont’d) ................................................................................. 73
11.8 Serial Output Timing........................................................................................................... 74
11.9 Serial Input Timing.............................................................................................................. 74
11.10 HOLD Timing .................................................................................................................... 74
11.11 WP Timing......................................................................................................................... 74
12. PACKAGE SPECIFICATION.......................................................................................................... 75
12.1 8-Pin SOIC 208-mil (Package Code SS) ........................................................................... 75
12.2 8-Contact 6x5mm WSON (Package Code ZP) .................................................................. 76
12.3 8-Contact 8x6mm WSON (Package Code ZE) .................................................................. 78
12.4 16-Pin SOIC 300-mil (Package Code SF).......................................................................... 79
13. ORDERING INFORMATION .......................................................................................................... 80
13.1 Valid Part Numbers and Top Side Marking........................................................................ 81
14. REVISION HISTORY...................................................................................................................... 82
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