ISD1800 Datasheet, PDF (7/26 Pages) Winbond – SINGLE-CHIP, SINGLE-MESSAGE VOICE RECORD/PLAYBACK DEVICE 6- TO 16-SECOND DURATION

I1800 SERIES
PIN NAME
MIC
PIN NO.
10
MIC REF
12
AGC
13
SP-/SP+
15, 17
V_CCA, V_CCD
18, 27
I/O
FUNCTION
I
Microphone Input: The microphone input
transfers its signals to the on-chip preamplifier. An
on-chip Automatic Gain Control (AGC) circuit
controls the gain of the preamplifier. An external
microphone should be AC coupled to this pin via
a series capacitor. The capacitor value, together
with an internal 10 KΩ resistance on this pin,
determines the low-frequency cutoff for the I1800
passband.
I
Microphone Reference: The MIC REF input is
the inverting input to the microphone preamplifier.
This provides input noise-cancellation, or
common-mode rejection, when the microphone is
connected differentially to the device.
I
Automatic Gain Control: The AGC dynamically
adjusts the gain of the preamplifier to compensate
for the wide range of microphone input levels. The
AGC allows the full range of sound, from whispers
to loud sounds, to be recorded with minimal
distortion. Nominal values of 4.7 µF give
satisfactory results in most cases.
O
Speaker Outputs: The SP+ and SP- pins provide
direct drive for loudspeakers with impedances as
low as 8Ω. A single output may be used, but, for
direct-drive loud-speakers, the two opposite-
polarity outputs provide an improvement in output
power of up to four times over a single-ended
connection. Furthermore, when SP+ and SP- are
used, a speaker coupling capacitor is not
required. A single-ended connection will require
an AC-coupling capacitor between the SP pin and
the speaker.
The SP+ pin and the SP- pin are internally
connected through a 50 KΩ resistance. When not
in playback mode, they are floating.
Voltage Supplies: Analog and digital circuits
internal to the I1800 device use separate power
buses to minimize noise on the chip. These power
buses are brought out to separate pins on the
package and should be tied together as close to
the power supply as possible. It is important that
the power supply be decoupled as close as
possible to the package.
Publication Release Date: May 2003
-7-
Revision 0.0