ISD1800 Datasheet, PDF (22/26 Pages) Winbond – SINGLE-CHIP, SINGLE-MESSAGE VOICE RECORD/PLAYBACK DEVICE 6- TO 16-SECOND DURATION

I1800 SERIES
12.3. I1800 BONDING PHYSICAL LAYOUT (DIE)
I1800
o Die Dimensions
X: 2530µm (99.6mils)
Y: 2420µm (95.3mils)
PLAYL PLAYE REC V_SSD RECLED V_CCD XCLK FT
o Die Thickness
11.5 +0.5 mil (typ)
o Pad Opening
90 x 90 microns
ISD1810
MIC MIC REF AGC SP - V_SSA SP + V_CCA ROSC
Notes:
1. The backside of die is internally connected to V_SS. It MUST NOT be connected to any other potential or
damage may occur.
2. Die thickness is subject to change, please contact Winbond factory for status and availability.
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