ISD1800 Datasheet, PDF (4/26 Pages) Winbond – SINGLE-CHIP, SINGLE-MESSAGE VOICE RECORD/PLAYBACK DEVICE 6- TO 16-SECOND DURATION

I1800 SERIES
4. TABLE OF CONTENTS
1. GENERAL DESCRIPTION.................................................................................................................. 2
2. FEATURES ......................................................................................................................................... 2
3. BLOCK DIAGRAM .............................................................................................................................. 3
4. TABLE OF CONTENTS ...................................................................................................................... 4
5. PIN CONFIGURATION ....................................................................................................................... 5
6. PIN DESCRIPTION ............................................................................................................................. 6
7. FUNCTIONAL DESCRIPTION............................................................................................................ 9
7.1. Detailed Description.................................................................................................................. 9
7.2. Functional Description Example ........................................................................................... 10
8. TIMING DIAGRAMS.......................................................................................................................... 12
9. ABSOLUTE MAXIMUM RATINGS ^[1] ................................................................................................ 15
9.1 Operating Conditions ............................................................................................................... 16
10. ELECTRICAL CHARACTERISTICS ............................................................................................... 17
10.1. DC Parameters...................................................................................................................... 17
10.2. AC Parameters^[1] ................................................................................................................... 18
11. TYPICAL APPLICATION CIRCUIT ................................................................................................. 19
12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 20
12.1. 28-Lead 300mil Small Outline IC (SOIC) Package.......................................................... 20
12.2. 28-Lead 0.600-Inch Plastic Dual Inline Package (PDIP) – For Sampling Only........... 21
12.3. I1800 Bonding Physical Layout (Die)................................................................................. 22
13. ORDERING INFORMATION........................................................................................................... 24
14. VERSION HISTORY ....................................................................................................................... 25
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