W25Q40BV_12 Datasheet, PDF (6/73 Pages) Winbond – 4M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

W25Q40BV
3. PACKAGE TYPES
3.1 Pin Configuration SOIC /VSOP 150-mil, SOIC 208-mil
Top View
/CS
1
8
VCC
DO (IO₁)
/WP (IO₂)
GND
2
7
3
6
4
5
/HOLD (IO₃)
CLK
DI (IO₀)
Figure 1a. W25Q40BL Pin Assignments, 8-pin SOIC/VSOP 150-mil, SOIC 208-mil (Package Code SN, SV & SS)
3.2 Pad Configuration WSON 6X5-mm, USON 2X3-mm
/CS
DO (IO₁)
/WP (IO₂)
GND
Top View
18
27
36
45
VCC
/HOLD (IO₃)
CLK
DI (IO₀)
Figure 1b. W25Q40BL Pad Assignments, 8-pad WSON 6x5-mm, USON 2x3-mm (Package Code ZP & UX)
3.3 Pin Configuration PDIP 300-mil
Top View
/CS
1
8
VCC
DO (IO₁)
2
/WP (IO₂)
3
GND
4
7
/HOLD (IO₃)
6
CLK
5
DI (IO₀)
Figure 1c. W25Q16CV Pin Assignments, 8-pin PDIP (Package Code DA)
3.4 Pin Description SOIC, VSOP, WSON, USON, PDIP
PIN NO.
PIN NAME
I/O
FUNCTION
1
/CS
I
Chip Select Input
2
DO (IO1)
I/O Data Output (Data Input Output 1)*¹
3
/WP (IO2)
I/O Write Protect Input ( Data Input Output 2)*²
4
GND
Ground
5
DI (IO0)
I/O Data Input (Data Input Output 0)*¹
6
CLK
I
Serial Clock Input
7
/HOLD (IO3)
I/O Hold Input (Data Input Output 3)*²
8
VCC
Power Supply
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI instructions
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