W25X40CL Datasheet, PDF (48/53 Pages) Winbond – 2.5/3/3.3 V 4M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI

10.5 8-Pad WSON 6x5mm Cont’d.
W25X40CL
SYMBOL
M
N
P
Q
R
MILLIMETERS
MIN
TYP.
MAX
MIN
SOLDER PATTERN
3.40
4.30
6.00
0.50
0.75
INCHES
TYP.
MAX
0.1338
0.1692
0.2360
0.0196
0.0255
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
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Publication Release Date: October 15, 2012
Revision E