W25X40CL Datasheet, PDF (46/53 Pages) Winbond – 2.5/3/3.3 V 4M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI

10.3 8-Pin SOIC 208-mil (Package Code SS)
W25X40CL
SYMBOL
A
A1
A2
b
C
D
D1
E
E1
e
H
L
y

MILLIMETER
MIN
1.75
0.05
1.70
0.35
0.19
5.18
5.13
5.18
5.13
7.70
0.50
―
0
TYP.
1.95
0.15
1.80
0.42
0.20
5.28
5.23
5.28
5.23
1.27BSC
7.90
0.65
―
―
MAX
2.16
0.25
1.91
0.48
0.25
5.38
5.33
5.38
5.33
8.10
0.80
0.10
8
MIN
0.069
0.002
0.067
0.014
0.007
0.204
0.202
0.204
0.202
0.303
0.020
―
0
INCHES
TYP.
0.077
0.006
0.071
0.017
0.008
0.208
0.206
0.208
0.206
0.050 BSC
0.311
0.026
―
―
MAX
0.085
0.010
0.075
0.019
0.010
0.212
0.210
0.212
0.210
0.319
0.031
0.004
8
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D/E/D1/E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
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Publication Release Date: October 15, 2012
Revision E