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W25X40CL Datasheet, PDF (3/53 Pages) Winbond – 2.5/3/3.3 V 4M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI
W25X40CL
8.2.16 32KB Block Erase (52h) ...............................................................................................27
8.2.17 Block Erase (D8h) ........................................................................................................28
8.2.18 Chip Erase (C7h or 60h)...............................................................................................29
8.2.19 Power-down (B9h)........................................................................................................30
8.2.20 Release Power-down / Device ID (ABh).......................................................................31
8.2.21 Read Manufacturer / Device ID (90h) ...........................................................................33
8.2.22 Read Manufacturer / Device ID Dual I/O (92h) .............................................................34
8.2.23 Read Unique ID Number (4Bh) ....................................................................................35
8.2.24 JEDEC ID (9Fh)............................................................................................................36
9. ELECTRICAL CHARACTERISTICS ......................................................................................... 37
9.1 Absolute Maximum Rating............................................................................................ 37
9.2 Operating Ranges......................................................................................................... 37
9.3 Power-up Timing and Write Inhibit Threshold .............................................................. 38
9.4 DC Electrical Characteristics ........................................................................................ 39
9.5 AC Measurement Conditions........................................................................................ 40
9.6 AC Electrical Characteristics ........................................................................................ 41
AC Electrical Characteristics (cont’d)........................................................................................ 42
9.7 Serial Output Timing ..................................................................................................... 43
9.8 Serial Input Timing ........................................................................................................ 43
9.9 HOLD Timing ................................................................................................................ 43
9.10 WP Timing .................................................................................................................... 43
10. PACKAGE SPECIFICATION .................................................................................................... 44
10.1 8-Pin SOIC 150-mil (Package Code SN)...................................................................... 44
10.2 8-Pin VSOP8 150-mil (Package Code SV)................................................................... 45
10.3 8-Pin SOIC 208-mil (Package Code SS) ...................................................................... 46
10.4 8-Pad 6x5mm WSON (Package Code ZP) .................................................................. 47
10.5 8-Pad WSON 6x5mm Cont’d........................................................................................ 48
10.6 8-Pad USON 2x3-mm (Package Code UX).................................................................. 49
10.7 8-pin PDIP 300-mil (Package Code DA) ...................................................................... 50
11. ORDERING INFORMATION..................................................................................................... 51
11.1 Valid Part Numbers and Top Side Marking .................................................................. 52
12. REVISION HISTORY ................................................................................................................ 53
Publication Release Date: October 15, 2012
-3-
Revision E