W25X16BV Datasheet, PDF (43/47 Pages) Winbond – 16M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

8-Pad WSON 6x5mm Cont’d.
W25X16BV
SYMBOL
MILLIMETERS
MIN
TYP.
MAX
SOLDER PATTERN
M
3.40
N
4.30
P
6.00
Q
0.50
R
0.75
INCHES
MIN
TYP.
MAX
0.1338
0.1692
0.2360
0.0196
0.0255
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of
exposed PCB vias under the pad.
- 43 -
Publication Release Date: October 7, 2009
Preliminary -- Revision C