W25X16BV Datasheet, PDF (2/47 Pages) Winbond – 16M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X16BV
Table of Contents
1.
GENERAL DESCRIPTION ......................................................................................................... 4
2.
FEATURES ................................................................................................................................. 4
3.
PIN CONFIGURATION SOIC 150 / 208-MIL.............................................................................. 5
4.
PAD CONFIGURATION WSON 6X5-MM .................................................................................. 5
5.
PAD CONFIGURATION PDIP 300-MIL...................................................................................... 6
6.
PIN DESCRIPTION SOIC 150 / 208-MIL, PDIP 300-MIL, WSON 6X5-MM............................... 6
7.
PIN CONFIGURATION SOIC 300-MIL....................................................................................... 7
8.
PIN DESCRIPTION SOIC 300-MIL ............................................................................................ 7
8.1 Package Types ............................................................................................................... 8
8.2 Chip Select (/CS) ............................................................................................................ 8
8.3 Serial Data Output (DO) ................................................................................................. 8
8.4 Write Protect (/WP)......................................................................................................... 8
8.5 HOLD (/HOLD) ............................................................................................................... 8
8.6 Serial Clock (CLK) .......................................................................................................... 8
8.7 Serial Data Input / Output (DIO) ..................................................................................... 8
9.
BLOCK DIAGRAM ...................................................................................................................... 9
10. FUNCTIONAL DESCRIPTION ................................................................................................. 10
10.1 SPI OPERATIONS ....................................................................................................... 10
10.1.1 SPI Modes ....................................................................................................................10
10.1.2 Dual Output SPI............................................................................................................10
10.1.3 Hold Function ...............................................................................................................10
10.2 WRITE PROTECTION.................................................................................................. 11
10.2.1 Write Protect Features..................................................................................................11
11. CONTROL AND STATUS REGISTERS................................................................................... 12
11.1 STATUS REGISTER .................................................................................................... 12
11.1.1 BUSY............................................................................................................................12
11.1.2 Write Enable Latch (WEL) ............................................................................................12
11.1.3 Block Protect Bits (BP2, BP1, BP0)..............................................................................12
11.1.4 Top/Bottom Block Protect (TB).....................................................................................12
11.1.5 Reserved Bits ...............................................................................................................12
11.1.6 Status Register Protect (SRP) ......................................................................................13
11.1.7 Status Register Memory Protection ..............................................................................13
11.2 INSTRUCTIONS........................................................................................................... 14
11.2.1 Manufacturer and Device Identification.........................................................................14
11.2.2 Instruction Set...............................................................................................................15
11.2.3 Write Enable (06h)........................................................................................................16
11.2.4 Write Disable (04h).......................................................................................................16
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