W25X16BV Datasheet, PDF (40/47 Pages) Winbond – 16M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

13.2 8-Pin SOIC 208-mil (Package Code SS)
W25X16BV
SYMBOL
A
A1
A2
b
C
D
D1
E
E1
e
H
L
y
θ
MILLIMETERS
MIN
NOM MAX
1.75
0.05
1.70
0.35
0.19
5.18
5.13
5.18
5.13
7.70
0.50
-
0°
1.95
0.15
1.80
0.42
0.20
5.28
5.23
5.28
5.23
1.27 BSC
7.90
0.65
-
-
2.16
0.25
1.91
0.48
0.25
5.38
5.33
5.38
5.33
8.10
0.80
0.010
8°
MIN
0.069
0.002
0.067
0.014
0.007
0.204
0.202
0.204
0.202
0.303
0.020
-
0°
INCHES
NOM
0.077
0.006
0.071
0.017
0.008
0.208
0.206
0.208
0.206
0.050 BSC
0.311
0.026
-
-
MAX
0.085
0.010
0.075
0.019
0.010
0.212
0.210
0.212
0.210
0.319
0.031
0.004
8°
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
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