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W9751G8KB Datasheet, PDF (4/87 Pages) Winbond – 16M x 4 BANKS 꼌 8 BIT DDR2 SDRAM | |||
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W9751G8KB
1. GENERAL DESCRIPTION
The W9751G8KB is a 512M bits DDR2 SDRAM, organized as 16,777,216 words ï´ 4 banks ï´ 8 bits.
This device achieves high speed transfer rates up to 1066Mb/sec/pin (DDR2-1066) for general
applications. W9751G8KB is sorted into the following speed grades: -18, -25, 25I and -3. The -18 is
compliant to the DDR2-1066 (7-7-7) specification. The -25/25I are compliant to the DDR2-800 (5-5-5)
or DDR2-800 (6-6-6) specification (the 25I industrial grade which is guaranteed to support -40°C â¤
TCASE ⤠95°C). The -3 is compliant to the DDR2-667 (5-5-5) specification.
All of the control and address inputs are synchronized with a pair of externally supplied differential
clocks. Inputs are latched at the cross point of differential clocks (CLK rising and CLK falling). All
I/Os are synchronized with a single ended DQS or differential DQS- DQS pair in a source
synchronous fashion.
2. FEATURES
ï¬ Power Supply: VDD, VDDQ = 1.8 V ï± 0.1 V
ï¬ Double Data Rate architecture: two data transfers per clock cycle
ï¬ CAS Latency: 3, 4, 5, 6 and 7
ï¬ Burst Length: 4 and 8
ï¬ Bi-directional, differential data strobes (DQS and DQS ) are transmitted / received with data
ï¬ Edge-aligned with Read data and center-aligned with Write data
ï¬ DLL aligns DQ and DQS transitions with clock
ï¬ Differential clock inputs (CLK and CLK )
ï¬ Data masks (DM) for write data.
ï¬ Commands entered on each positive CLK edge, data and data mask are referenced to both edges
of DQS
ï¬ Posted CAS programmable additive latency supported to make command and data bus efficiency
ï¬ Read Latency = Additive Latency plus CAS Latency (RL = AL + CL)
ï¬ Off-Chip-Driver impedance adjustment (OCD) and On-Die-Termination (ODT) for better signal
quality
ï¬ Auto-precharge operation for read and write bursts
ï¬ Auto Refresh and Self Refresh modes
ï¬ Precharged Power Down and Active Power Down
ï¬ Write Data Mask
ï¬ Write Latency = Read Latency - 1 (WL = RL - 1)
ï¬ Interface: SSTL_18
ï¬ Packaged in WBGA 60 Ball (8X12.5 mm2), using Lead free materials with RoHS compliant
Publication Release Date: Feb. 15, 2012
-4-
Revision A01
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