W25X10 Datasheet, PDF (39/45 Pages) Winbond – 1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X10, W25X20, W25X40, W25X80
12.2 8-Pin SOIC 208-mil (Package Code SS)
SYMBOL
A
A1
A2
b
C
D
E
E1
e
L
θ
y
MILLIMETERS
MIN
MAX
1.75
2.16
0.05
0.25
1.70
1.91
0.35
0.48
0.19
0.25
5.18
5.38
7.70
8.10
5.18
5.38
1.27 BSC
0.50
0.80
0^o
8^o
---
0.10
INCHES
MIN
MAX
0.069 0.085
0.002 0.010
0.067 0.075
0.014 0.019
0.007 0.010
0.204 0.212
0.303 0.319
0.204 0.212
0.050 BSC
0.020 0.031
0^o
8^o
---
0.004
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
- 39 -
Publication Release Date: September 22, 2006
Preliminary - Revision I