ISD2560 Datasheet, PDF (38/42 Pages) Winbond – ISD2560

ISD2560/75/90/120
12.4. ISD2560/75/95/120 PRODUCT BONDING PHYSICAL LAYOUT (DIE) ^[1]
ISD2560/75/95/120
o Die Dimensions
X: 149.5 + 1 mils
Y: 262.0 + 1 mils
o Die Thickness ^[2]
11.8 + .4 mils
o Pad Opening
111 x 111 microns
4.4 x 4.4 mils
A3 A1
V_{CCD XCLK}
A2 A0
P/R EOM
PD
A4
CE
A5
A6
OVF
ISD2560/75/90/120X
≈
≈
A7
ANA OUT
A8
ANA IN
A9
AUX IN
V_SSA
SP- MIC
AGC
V_SSD
SP+
V_CCA MIC REF
Notes:
[1] _{The backside of die is internally connected to VSS. It MUST NOT be connected to any other potential or damage may}
occur.
[2] _{Die thickness is subject to change, please contact Winbond factory for status and availability.}
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