ISD2560 Datasheet, PDF (30/42 Pages) Winbond – ISD2560

ISD2560/75/90/120
11. TYPICAL APPLICATION CIRCUIT
V_CC
V_SS
CHIP ENABLE
R4
100 KΩ
POWER DOWN
PLAYBACK/RECORD
ISD2560/75/90/120
V_CC
1 _A0
2 _A1
3 _A2
4 _A3
5 _A4
6 _A5
7 _A6
8 _A7
9 _A8
10 _A9
23 _CE
24 _PD
27 _P/R
25 _OEM
22 _OVF
26 _XCLK
V_CCD 28
V_CCA 16
C6
0.1 _µ F
V_SSD ¹²
V_SSA ¹³
SP+ ¹⁴
SP- ¹⁵
AUX IN ¹¹
ANA IN ²⁰
ANA OUT ²¹
R6
5.1 K Ω
C7
0.1 µ F
C3
0.1 µ F
C8
22 µF
16 Ω
SPEAKER
MIC REF ¹⁸
MIC ¹⁷
AGC ¹⁹
(Note)
V_CC
C1
0.1 µ F
R1
1 KΩ
R3
10 KΩ
R2
470 KΩ
C2
4.7 µ F
C4
220 µ F
ELECTRET
MICROPHONE
C5
0.1 µ F
R5
10 KΩ
FIGURE 5: DESIGN SCHEMATIC
Note: If desired, pin 18 (PDIP package) may be left unconnected (microphone preamplifier noise will be higher). In
this case, pin 18 must not be tied to any other signal or voltage. Additional design example schematics are
provided below.
- 30 -