W39F010 Datasheet, PDF (31/33 Pages) Winbond – 128K × 8 CMOS FLASH MEMORY

W39F010
Package Dimensions, Continued
13.3 32-pin PLCC
4
5
HE
E
1 32
30
29
D HD
13
14
20
L
θ
Seating Plane
e
b
b1
GE
21
A2
A
A1
y
GD
c
Symbol
A
A1
A2
b1
b
c
D
E
e
GD
GE
HD
HE
L
y
θ
Dimension in Inches
Min. Nom. Max.
0.140
0.020
0.105 0.110 0.115
0.026
0.016
0.008
0.028
0.018
0.010
0.032
0.022
0.014
0.547
0.550 0.553
0.447
0.450 0.453
0.044 0.050 0.056
0.490 0.510 0.530
0.390
0.410 0.430
0.585
0.485
0.590
0.490
0.595
0.495
0.075
0.090
0.095
0.004
0
10
Dimension in mm
Min. Nom. Max.
3.56
0.50
2.67
2.80
2.93
0.66
0.71
0.81
0.41
0.46
0.56
0.20
0.25
0.35
13.89 13.97 14.05
11.35 11.43 11.51
1.12
1.27
1.42
12.45 12.95 13.46
9.91 10.41 10.92
14.86
12.32
14.99
12.45
15.11
12.57
1.91
2.29
2.41
0.10
0
10
Notes:
1. Dimensions D & E do not include interlead flash.
2. Dimension b1 does not include dambar protrusion/intrusion.
3. Controlling dimension: Inches.
4. General appearance spec. should be based on final
visual inspection sepc.
13.4 32-pin STSOP (8 x 14 mm)
HD
D
e
b
θ
L
L1
c
E
A1
A
A2
Y
Dimension in Inches Dimension in mm
Symbol
Min. Nom. Max. Min. Nom. Max.
A
0.047
1.20
A1 0.002
0.006 0.05
0.15
A2
0.035 0.040 0.041 0.95 1.00 1.05
b
0.007 0.009 0.010 0.17 0.22 0.27
c
0.004 ----- 0.008 0.10 ----- 0.21
D
0.488
12.40
E
0.315
8.00
HD
0.551
14.00
e
0.020
0.50
L
0.020 0.024 0.028 0.50 0.60 0.70
L¹
0.031
0.80
Y
0.000
0.004 0.00
0.10
θ
0
3
5
0
3
5
Publication Release Date: December 26, 2005
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Revision A4