W39F010 Datasheet, PDF (29/33 Pages) Winbond – 128K × 8 CMOS FLASH MEMORY

W39F010
13. PACKAGE DIMENSIONS
13.1 32-pin P-DIP
32
E1
1
S
A ^A2
L
D
17
B
e1
B1
16
E
A1 _{Base Plane}
Seating Plane
a
eA
Dimension in inches Dimension in mm
Symbol _{Min. Nom. Max. Min. Nom. Max.}
A
0.210
5.33
A1 ^0.010
0.25
A2 ^{0.150 0.155 0.160 3.81 3.94 4.06}
B ^{0.016 0.018 0.022 0.41 0.46 0.56}
B1 ^{0.048 0.050 0.054 1.22 1.27 1.37}
c
0.008 0.010 0.014 0.20 0.25 0.36
D
1.650 1.660
41.91 42.16
E 0.590 0.600 ^0.610 14.99 ^{15.24 15.49}
E1 ^{0.545 0.550 0.555 13.84 13.97 14.10}
e1 ^{0.090 0.100 0.110 2.29 2.54 2.79}
L
0.120 0.130 0.140 3.05 3.30 3.56
a
0
15 0
15
eA ^{0.630 0.650 0.670 16.00 16.51 17.02}
S
0.085
2.16
Notes:
1.Dimensions D Max. & S include mold fla
c
tie bar burrs.
2.Dimension E1 does not include interlea
3.aDriemdeentseiromnisneDd&.atEt1heinmcluodldepmarotlidngmliinsma
4.Dimension B1 does not include dam
protrusion/intrusion.
5.Controlling dimension: Inches
6.General appearance spec. should be ba
final visual inspection spec.
Publication Release Date: December 26, 2005
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Revision A4