W25X16 Datasheet, PDF (3/47 Pages) Winbond – 16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X16, W25X32, W25X64
11.2.4 Write Disable (04h).......................................................................................................18
11.2.5 Read Status Register (05h) ..........................................................................................19
11.2.6 Write Status Register (01h) ..........................................................................................20
11.2.7 Read Data (03h) ...........................................................................................................21
11.2.8 Fast Read (0Bh) ...........................................................................................................22
11.2.9 Fast Read Dual Output (3Bh) .......................................................................................23
11.2.10 Page Program (02h) ...................................................................................................24
11.2.11 Sector Erase (20h) .....................................................................................................25
11.2.12 Block Erase (D8h) ......................................................................................................26
11.2.13 Chip Erase (C7h)........................................................................................................27
11.2.14 Power-down (B9h) ......................................................................................................28
11.2.15 Release Power-down / Device ID (ABh) .....................................................................29
11.2.16 Read Manufacturer / Device ID (90h) .........................................................................31
11.2.17 JEDEC ID (9Fh)..........................................................................................................32
12. ELECTRICAL CHARACTERISTICS (PRELIMINARY)............................................................. 33
12.1 Absolute Maximum Ratings .......................................................................................... 33
12.2 Operating Ranges......................................................................................................... 33
12.3 Endurance and Data Retention .................................................................................... 34
12.4 Power-up Timing and Write Inhibit Threshold .............................................................. 34
12.5 DC Electrical Characteristics ........................................................................................ 35
12.6 AC Measurement Conditions........................................................................................ 36
12.7 AC Electrical Characteristics ........................................................................................ 37
12.8 AC Electrical Characteristics (Cont’d) .......................................................................... 38
12.9 Serial Output Timing ..................................................................................................... 39
12.10 Input Timing................................................................................................................. 39
12.11 Hold Timing ................................................................................................................. 39
13. PACKAGE SPECIFICATION .................................................................................................... 40
13.1 8-Pin SOIC 208-mil (Package Code SS)...................................................................... 40
13.2 8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 41
13.3 8-contact 6x5 WSON .................................................................................................... 42
13.4 8-contact 6x5 WSON (Cont’d) ...................................................................................... 43
13.5 16-Pin SOIC 300-mil (Winbond Package Code SF)..................................................... 44
14. ORDERING INFORMATION .................................................................................................... 45
15. REVISION HISTORY ................................................................................................................ 46
Publication Release Date:
-3-
February 26, 2007, Revision E