W19B160BTT7H Datasheet, PDF (3/47 Pages) Winbond – 2.7~3.6-volt write (program and erase) operations, Fast write operation

W19B160BT/B DATA SHEET
10.2 Reset Waveform ........................................................................................................... 38
10.3 #BYTE Waveform for Read Operation ......................................................................... 39
10.4 #BYTE Waveform for Write Operation ......................................................................... 39
10.5 Programming Waveform............................................................................................... 40
10.6 Chip/Sector Erase Waveform ....................................................................................... 40
10.7 #Data Polling Waveform (During Embedded Algorithms) ............................................ 41
10.8 Toggle Bit Waveform (During Embedded Algorithms) ................................................. 41
10.9 Temporary Sector Unprotect Timing Diagram.............................................................. 42
10.10 Sector Protect and Unprotect Timing Diagram ........................................................ 42
10.11 Alternate #CE Controlled Write (Erase/Program) Operation Timing ....................... 43
11. LATCHUP CHARACTERISTICS .............................................................................................. 44
12. CAPACITANCE......................................................................................................................... 44
13. ORDERING INFORMATION .................................................................................................... 45
Quality: Grade & Green
H: Extended (-20℃ ~85 ℃ )with Green package
M:Industrial (-40℃ ~85 ℃ )with Green package
SPEEDOPTION
7 : 70 ~ 79ns
9 : 90 ~ 99ns
PACKAGE TYPE
T = 48 - Pin TSOP Package, 12 x 20mm
BOOT CODE SECTOR ARCHITECTURE
T = Top sector
B = Bottom sector
DEVICE NUMBER/DESCRIPTION
W19B160B
16 Megabit (2M x-8Bit/ 1 M x 16- Bit) CMOS Flash Memory
PACKAGE DIMENSIONS ..................................................................................................................... 45
PACKAGE DIMENSIONS ..................................................................................................................... 46
14. VERSION HISTORY ................................................................................................................. 47
Publication Release Date Apr,20, 2009
-3-
Revision A9