W39L040 Datasheet, PDF (25/27 Pages) Winbond – 512 K X 8 CMOS FLASH MEMORY

W39L040
12. PACKAGE DIMENSIONS
32L PLCC
4
5
HE
E
1 32
30
29
D HD
13
14
20
L
θ
Seating Plane
e
b
b1
GE
21
A2
A
A1
y
32L TSOP (8 x 20 mm)
HD
D
Me
0.10(0.004)
b
θL
L1
GD
c
Symbol
A
A1
A2
b1
b
c
D
E
e
GD
GE
HD
HE
L
y
θ
Dimension in Inches
Min. Nom. Max.
0.140
0.020
0.105
0.026
0.016
0.008
0.110
0.028
0.018
0.010
0.115
0.032
0.022
0.014
0.547
0.447
0.550
0.450
0.553
0.453
0.044 0.050 0.056
0.490
0.390
0.585
0.485
0.510
0.410
0.590
0.490
0.530
0.430
0.595
0.495
0.075
0.090
0.095
0.004
0
10
Dimension in mm
Min. Nom. Max.
3.56
0.50
2.67
2.80
2.93
0.66
0.71
0.81
0.41
0.46
0.56
0.20
0.25
0.35
13.89
11.35
13.97
11.43
14.05
11.51
1.12
1.27
1.42
12.45 12.95 13.46
9.91
14.86
12.32
10.41
14.99
12.45
10.92
15.11
12.57
1.91
2.29
2.41
0.10
0
10
Notes:
1. Dimensions D & E do not include interlead flash.
2. Dimension b1 does not include dambar protrusion/intrusion.
3. Controlling dimension: Inches.
4. General appearance spec. should be based on final
visual inspection sepc.
c
E
A
A2
A1
Y
Symbol
A
A1
Dimension in Inches
Min.
__
0.002
Nom.
__
__
Max.
0.047
0.006
Dimension in mm
Min. Nom.
__ __
__
0.05
Max.
1.20
0.15
A 2 0.037 0.039 0.041 ^0.95 1.00 1.05
b
0.007 0.008 0.009 0.17 0.20 0.23
c
0.005 0.006 0.007 0.12 0.15 0.17
D
0.720 0.724 0.728 18.30 18.40 18.50
E
0.311 0.315 0.319 7.90 8.00 8.10
H D ^{0.780 0.787 0.795 19.80 20.00 20.20}
e
__
__ __
__
0.020
0.50
L
0.016 0.020 0.024 0.40 0.50 0.60
L1
__
__ __
__
0.031
0.80
Y
0.000
__
0.004 0.00
__
0.10
θ
1
3
5
1
3
5
Note:
Controlling dimension: Millimeters
- 25 -
Publication Release Date: February 10, 2003
Revision A3