W83L518D_05 Datasheet, PDF (24/25 Pages) Winbond – Integrated Media Reader

W83L518D
Memory Stick Socket (1) Circuit.
MSPWCTL#
R2 33
1
2
3VCC
Q1
MS_3VCC
3VCC
C1
MOSFET P
0.1U
R3
+ C2
4.7K
Soft start to
1U
protect
MS1
MOSFET(Optional)
MS2
MS3
MS4
MS5
MSCLK
MS_3VCC
D2
R4 330
MSLED
R6 1K
1
2
LED
MS read/write LED
Q2
NPN
(OPTION:reserved
for power-down)
R5 C3
200K
0.1U
MS_3VCC
R1 330
1
2
D1
LED
J1
1
2
3
4
5
6
7
8
9
10
MS_SOCKET
SCPWCTL#
SCC4
SCIO
SCCLK
Extension Connectors
SD1
SD2
SD3
SD4
SD5
SDCLK
SDPWCTL#
SDLED
3VCC
JP1
SD1
1
2
SD2
3
SD3
4
SD4
5
SD5
6
SDCLK
SDPWCTL#
SDLED
7
8
9
10
MS1
MS2
MS3
MS4
MS5
MSCLK
MSPWCTL#
MSLED
3VCC
JP2
MS1
1
2
MS2
3
MS3
4
MS4
5
MS5
6
MSCLK
7
MSPWCTL#
8
MSLED
9
10
3VCC
R7
1M
SD4
3VCC
R9
1M
MS4
5VCC
SCPWCTL#
SCC4
SCIO
SCCLK
JP3
1
6
2
7
3
8
4
9
5
10
HEADER 5X2
SCRST#
SCLED
SCC8
SCPSNT
SCRST#
SCLED
SCC8
SCPSNT
SD1
R8
1M
MS1
R10
1M
SCPSNT
R11
1M
Winbond Recommended Reader Board
<<Connector Side>>
R_JP1,2: 1x10 ; 2.0 mm(pitch)
R_J1 : 2x5 ; 2.54 mm(pitch)
PIN 1 _{(R_JP2)}
PIN
10
PIN 1
(R_JP1) ^PIN
10
PIN 6
PIN 1
10
2
5
(R_J1)
Note 1:The RESET# should be connected with a low asserted signal like PCIRST#
on PCI bus or LREST#on LPC bus(active low)
Note 2:There is either function of SD and MS can be used on versio A but two
sockets interface can be implemented on version B.
Note 3:If any of SC or MS/SD function isn't intened to use, signals like
SCPSNT/SD1/MS1 should be tied to a pull-down resistor and SD4/MS4
should be tied to a pull-high resistors. (recommended: 1M Ohm )
Note 4:^{The trade marks and intellectual property rights of Memory Stick belong to SONY}
Corporation.Information check: http://www.memorystick.org
Note 5:^{If JP1,2,3,4 are designed for Winbond recommended reader please meet following}
connector spec.
JP1,2: 1X10;pitch(2.0mm)
JP3: 2X5 ;pitch(2.54mm)
Note 6:^{For the recommended reader, please contact to Taiwan Zetatronic Industrial}
CO.,LTD(http://www.tzt.com.tw)
Note
7_(V:_eTrhe0r.e1
are
-->
some difference
Ver 0.2)
as
following
from
previous
version:
(1)Added circuit(GP10/EX-CD)to implement to sockets with external card detection pin.
(2)Modified pulled-high resistor for write_protect detection from 500 ohm to 4.7K ohm.
(3)Added configuration port selection pin(GP10/HEFRAS) by power-on strapping.
(Ver 0.2 --> Ver 0.3)
(1)Added power-on strapping circuit of different configuration port.(2E/2F)
(2)Modified pull-down resistor tied to SD1 from 200K ohm to 1M ohm.
(Ver 0.3 --> Ver 0.4)
(1)Modified some erroneous netname like SCPWR#,MSPWR# and SDPWR#.
(2)DMA transaction cannot be supported in this version.
(Ver 0.4 --> Ver 0.5)
(1)Modified SD2,3,4,5 pull up to SD_3VCC.
(2)Add without SD LED recommend circuit.
(Ver 0.5 --> Ver 0.6)
(1)Modified Note 3 .
inbond
Title
WINBOND ELECTRONICS CORP.
Size
B
Document Number
W83L518D Recommend Circuit
Rev
0.6
Date:
Wednesday, October 02, 2002
Sheet
2
of
2
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