W29F102 Datasheet, PDF (20/21 Pages) Winbond – 64K 16 CMOS FLASH MEMORY

W29F102
PACKAGE DIMENSIONS
44-pin PLCC
6
7
HD
D
1 44
40
39
E HE
17
18
29
28
L
θ
e
b
Seating Plane
b1
GD
A2 A
A1
y
GE
c
Symbol
A
A1
A2
b1
b
c
D
E
e
GD
GE
HD
HE
L
y
Dimension in Inches
Min. Nom. Max.
0.185
Dimension in mm
Min. Nom. Max.
4.70
0.020
0.51
0.145 0.150 0.155 3.68 3.81 3.94
0.026 0.028 0.032 0.66 0.71 0.81
0.016 0.018 0.022 0.41 0.46 0.56
0.008 0.010 0.014 0.20 0.25 0.36
0.648 0.653 0.658 16.46 16.59 16.71
0.648 0.653 0.658 16.46 16.59 16.71
0.050 BSC
1.27 BSC
0.590 0.610 0.630 14.99 15.49 16.00
0.590 0.610 0.630 14.99 15.49 16.00
0.680 0.690 0.700 17.27 17.53 17.78
0.680 0.690 0.700 17.27 17.53 17.78
0.090 0.100 0.110 2.29 2.54 2.79
0.004
0.10
Notes:
1. Dimension D & E do not include interlead flash.
2. Dimension b1 does not include dambar
protrusion/intrusion.
3. Controlling dimension: Inches
4. General appearance spec. should be based
on final visual inspection spec.
40-pin TSOP (10 mm × 14 mm)
e1
M
0.10(0.004)
b
HD
D
θ
L
L1
c
E
A
A2
A1
Y
Dimension in Inches
Dimension in mm
Symbol _{Min. Nom. Max. Min. Nom. Max.}
A
0.047
1.20
A 1 0.002
0.006 0.05
0.15
A 2 0.037 0.039 0.041 ^0.95 1.00 1.05
b 0.007 0.009 0.011 0.17 0.22 0.27
c
0.004 0.006 0.008 0.10 0.15 0.20
D 0.484 0.488 0.492 12.30 12.40 12.50
E 0.390 0.394 0.398 9.90 10 10.10
H D 0.543 0.551 0.559 13.80 14.00 14.20
e
0.020
0.50
L 0.020 0.024 0.028 0.50 0.60 0.70
L1
0.031
0.8
Y 0.000
0.004 0.00
0.10
θ
0
3
5
0
3
5
Controlling dimension: Millimeters
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