W29C102 Datasheet, PDF (19/21 Pages) Winbond – 64K 16 CMOS FLASH MEMORY

W29C102
PACKAGE DIMENSIONS
40-pin PDIP
40
E1
1
S
A A2
L
D
B
e1
B1
21
20
E
Base Plane
A1
Seating Plane
a
eA
Symbol
A
A1
A2
B
B1
c
D
E
E1
e1
L
a
eA
S
Dimension in inches
Min. Nom. Max.
0.210
0.010
0.150 0.155 0.160
0.016 0.018 0.022
0.048 0.050 0.054
0.008 0.010 0.014
2.055 2.070
0.590 0.600 0.610
0.540 0.545 0.550
0.090 0.100 0.110
0.120 0.130 0.140
0
15
0.630 0.650 0.670
0.090
Dimension in mm
Min. Nom. Max.
5.33
0.25
3.81 3.94 4.06
0.41 0.46 0.56
1.22 1.27 1.37
0.20 0.25 0.36
52.20 52.58
14.99 15.24 15.49
13.72 13.84 13.97
2.29 2.54 2.79
3.05 3.30 3.56
0
15
16.00 16.51 17.02
2.29
Notes:
1. Dimensions D Max & S include mold flash or
tie bar burrs.
2. Dimension E1 does not include interlead flash.
c
3. Dimensions D & E1 include mold mismatch and
are determined at the mol.d parting line.
4. Dimension B1 does not include dambar
protrusion/intrusion.
5. Controlling dimension: Inches.
6. General appearance spec. should be based on
final visual inspection spec.
44-pin PLCC
6
7
HD
D
1 44
40
39
E HE
17
18
29
28
L
θ
Seating Plane
e
b
b1
GD
A2 A
A1
y
GE
c
Dimension in inches
Dimension in mm
Symbol _{Min. Nom. Max. Min. Nom. Max.}
A
0.185
4.70
A 1 ^0.020
0.51
A 2 ^{0.145 0.150} 0.155 ^{3.68 3.81 3.94}
b 1 ^{0.026 0.028 0.032 0.66} 0.71 ^0.81
b
0.016 0.018 0.022 0.41 0.46 0.56
c
0.008 0.010 0.014 0.20 0.25 0.36
D
0.648 0.653 0.658 16.46 16.59 16.71
E
0.648 0.653 0.658 16.46 16.59 16.71
e
0.050 BSC
1.27 BSC
G D 0.590 0.610 0.630 14.99 15.49 16.00
G E 0.590 0.610 0.630 14.99 15.49 16.00
H D ^0.680 0.690 0.700 ^17.27 17.53 17.78
H E 0.680 0.690 0.700 17.27 17.53 17.78
L
0.090 0.100 0.110 2.29 2.54 2.79
y
0.004
0.10
Notes:
1. Dimension D & E do not include interlead flash.
2. Dimension b1 does not include dambar
protrusion/intrusion.
3. Controlling dimension: Inches
4. General appearance spec. should be based
on final visual inspection spec.
- 19 -
Publication Release Date: March 1998
Revision A3