W29C022 Datasheet, PDF (19/20 Pages) Winbond – 256K x 8 CMOS FLASH MEMORY

W29C022
BONDING PAD DIAGRAM
5 44 3
2
1
32
32s
-1
32s
-2
31
30
29 28 27
A6 A7 A12 A15 A16 VccVcc VccWEA17A14A13 A8
6
26
A5
A9
7
25
A4
A11
Y
X
8
26
A3
A9
9
25
RA8048
A2
A11
10 11
12
13
14 15
16s 16s
-1 -2
17
18
19
20
21
22 23
A1 A0 I/O0I/O1I/O2GNDVSSVSSI/O3I/O4I/O5I/O6I/O7CE A10
PAD NO.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16S-1
16S-2
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32S-1
32S-2
32
X
-354.32
-491.12
-1085.00
-1221.80
-1387.04
-1500.86
-1500.86
-1470.02
-1470.02
-1316.36
-1179.56
-949.94
-699.98
-477.02
-271.34
-60.38
-17.38
209.57
432.53
682.49
905.45
1155.41
1378.97
1485.11
1485.11
1492.43
1492.43
1373.30
1236.50
815.66
503.66
366.86
180.71
138.11
-73.61
Y
3100.88
3100.88
3100.88
3100.88
3100.88
2893.70
2756.90
-2758.97
-2924.21
-3104.57
-3104.57
-3103.49
-3103.49
-3103.49
-3059.15
-3059.15
-3059.15
-3091.49
-3091.49
-3091.49
-3091.49
-3091.49
-3094.91
-2889.80
-2753.00
2745.20
2933.00
3100.88
3100.88
3100.88
3100.88
3100.88
3094.82
3094.82
3094.79
Note: For bare chip form (C.O.B.) applications, the substrate must be connected to VDD or left floating in the PCB layout.
- 19 -
Publication Release Date: March 26, 2002
Revision A3