W29EE012 Datasheet, PDF (18/19 Pages) Winbond – 128K X 8 CMOS FLASH MEMORY

W29EE012
BONDING PAD DIAGRAM
6 54 4
3 21
A6 _{A7 A12} A15 A16
6
A5
7
A4
33s 33s _{32 31}
-2 -1
30
Vcc Vcc Vcc #WE A14
29
28
A13
A8
27
A9
26
A11
Y
X
9
25
A3
#OE
10
24
RA8014
A2
A10
11
12 13 14
15
16
17s 17s
-1 -2
18 19 20 21 22 23
A1
A0 DQ0 DQ1 DQ2 GND ^{GNDGND DQ3} DQ4 DQ5 ^DQ6 DQ7 ^#CE
PAD NO.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17S-1
17S-2
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33S-1
33S-2
X
-187.04
-380.84
-517.64
-1121.73
-1258.52
-1484.75
-1484.75
-1484.75
-1453.92
-1453.92
-1453.92
-1240.62
-977.19
-727.22
-504.26
-264.72
-86.90
-1.70
286.06
509.01
758.98
981.94
1231.90
1469.29
1468.29
1469.29
1476.60
1476.60
1476.60
1311.85
891.00
523.36
310.36
180.16
94.96
Y
1920.30
1920.30
1920.30
1920.30
1920.30
1901.22
1713.42
1576.62
-1577.46
-1742.70
-1879.50
-1923.06
-1921.98
-1921.98
-1921.98
-1900.20
-1900.20
-1900.20
-1909.98
-1909.98
-1909.98
-1909.98
-1909.98
-1897.26
-1708.32
-1571.52
1564.62
1752.42
1889.22
1920.30
1920.30
1920.30
1914.24
1914.24
1914.24
Note: For bare chip form (C.O.B.) applications, the substrate must be connected to VDD or left floating in the PCB layout.
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