W27L01 Datasheet, PDF (15/15 Pages) Winbond – 128K X 8 ELECTRICALLY ERASABLE EPROM

W27L01
13. VERSION HISTORY
VERSION
DATE
A1
Apr. 2001
A2
May 31, 2002
A3
Feb. 20, 2003
PAGE
-
1, 5, 13
1, 13, 14
2, 3, 4, 6
3
6, 8
9
All
1, 13, 14
1, 12, 13
DESCRIPTION
Initial Issued
Modify Icc parameter from 10 mA to 15 mA
Add in DIP package
Correct the Vcv(VPP) as VPE(VPP) under Erase Inhibit Mode
Modify the Pin of VPP from VPE to VPP In the Erase Verify
Mode
Modify TA = 25°C ±5°C to 25°C
Modify Erase Waveform
Delete VDD = 5.0V ±10%
Add in TSOP(8 x 20 mm) package
Delete DIP package
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: [phone]
FAX: [phone]
http://www.winbond.com.tw/
Taipei Office
9F, No.480, Rueiguang Rd.,
Neihu District, Taipei, 114,
Taiwan, R.O.C.
TEL: [phone]
FAX: [phone]
Winbond Electronics Corporation America
2727 North First Street, San Jose,
CA 95134, U.S.A.
TEL: [phone]
FAX: [phone]
Winbond Electronics (Shanghai) Ltd.
27F, 2299 Yan An W. Rd. Shanghai,
200336 China
TEL: [phone]
FAX: [phone]
Winbond Electronics Corporation Japan
7F Daini-ueno BLDG, 3-7-18
Shinyokohama Kohoku-ku,
Yokohama, 222-0033
TEL: [phone]
FAX: [phone]
Winbond Electronics (H.K.) Ltd.
Unit 9-15, 22F, Millennium City,
No. 378 Kwun Tong Rd.,
Kowloon, Hong Kong
TEL: [phone]
FAX: [phone]
Please note that all data and specifications are subject to change without notice.
All the trade marks of products and companies mentioned in this data sheet belong to their respective owners.
- 15 -
Publication Release Date: February 20, 2003
Revision A3