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MMBD3004S Datasheet, PDF (1/3 Pages) Diodes Incorporated – HIGH VOLTAGE SURFACE MOUNT SWITCHING DIODE | |||
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WILLAS FM120-M+
HIGH VOLTAGE SURFACE MOUNT
1.0ASSWURITFACCHEIMNOGUNDTIOSCDHEOTTKY BARRIER RECTIFIERS
-20V-
MMBD3004S THRU
200V
FM1200-M+
SOD-123+ PACKAGE
Pb Free Product
Features
⢠Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
⢠L·owFparsotfiSlewsiutrcfhaicnegmSopuenetedd application in order to
⢠Lo·opwtimHpioizgwehebCrolaoorsndsd,suhpciatgachene.cfeficiency.
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⢠Terminals :Plated terminals, solderable per MIL-STD-750
Method 2026
Package outline
SOD-123H
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
0.071(1.8)
0.056(1.4)
SOT â23
0.031(0.8) Typ.
CAHODE/ANODE
3
0.040(1.0)
0.024(0.6)
0.031(0.8) Typ.
1
ANODE
2
CATHODE
⢠Polarity : Indicated by cathode band
Dimensions in inches and (millimeters)
⢠MMouanxtinimg PuomsitiRona:tAinnygs @ TA=25â unless otherwise specified
⢠Weight : ApproximateCdh0a.r0a1c1tegrriasmtic
Symbol
MMBD3004S
Unit
RepetiMtivAeXPIeMakURMevRerAseTVINolGtagSe AND ELECTRICAL CHAVRRARMCTERISTICS 350
V
Ratings atW25oârkinagmPbeieanktRteemvepresreaVtuorletaugneless otherwise specified.
VRWM
Single phaDseChBallof cwkaivneg,V6o0lHtazg,eresistive of inductive load.
VR
300
V
For capacitive load, derate current by 20%
RMS Reverse Voltage
VR(RMS)
212
V
RATINGS
Marking CoFdeorward Continuous Current(Note 2)
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH U
12
13IF 14
15 225 16
18 mA10
115 120
Maximum RPeecaukrreRnetpPeetiatkivReeFveorrsweaVrdoltCaugerrent(Note 2) VRRM
20
3I0FRM 40
50 625 60
80 mA100
150
200 V
Maximum RNMoSnV-Roeltapgeetitive Peak Forward Surge CurreVnRtMS@t=1.104µs
Maximum DC Blocking Voltage
VDC @t=12.00s
Maximum Average Forward Rectified Current
IO
Power Dissipation(Note 2)
21
28
3I0FSM 40
Pd
35 4.0 42
50 1.0 60
56
70
80
A100
1.0
350
mW
105
140 V
150
200 V
A
Peak ForwarTdhSeurrmgealCRureresnistt8a.n3cmesJsuinngclteiohnalftosinAem-wbaiveent AIiFrS(MNote 2)
R0JA
357 30
â/W
A
superimposed on rated load (JEDEC method)
Typical TheOrmpaelrRateisnigstaanncdeS(tNooratege2)Temperature RangeRÎJA
Tj, TSTG
-65 to +150 40
â
â
Typical Junction Capacitance (Note 1)
CJ
120
P
Operating TEemlepecrtartuirceaRlanCgeharacteristics @ TAT=J25â unless-5o5thtoer+w12is5e specified, per element
-55 to +150
Storage Temperature Range
TSTG
- 65 to +175
Characteristic
Symbol Min Typ MAX Unit
Test Condition
ReverseCBHrAeaRkAdCoTwEnRVISoTlItCagSe(Note 1) SYMBVO(LBRFM)R120-M3H5F0M130-MH FM140-MH FM150-MVH FM16I0R-M=H10F0Mµ1A80-MH FM1100-MH FM1150-MH FM1200-MH U
Maximum Forward Voltage at 1.0A DC
Maximum Average Reverse Current at @T A=25â
Rated DC BFloocrkwinagrdVoVltoalgtaege(Note 1) @T A=125â
VF
IR VF
0.07.850 0.87 0.70 IF=20mA 0.85
0.5
0.93
1.0
V IF1=0100mA
0.9
0.92 V
m
1.03 1.25
IF=200mA
NOTES:
1- MeasuredRate1veMrHseZ Canudrraepnptl(ieNdorteeve1r)se voltage of 4.0 VDC.
IR
2- Thermal Resistance From Junction to Ambient
30
100 nA VR=240V
35
100 µA VR=240V, Tj=150â
Total Capacitance
CT
1.0
5.0 Pf VR=0V, f=1.0MHZ
Reverse Recovery Time
Trr
IF=IR=30mA
50
ns
Irr=3.0mA, RL=100â¦
Notes: 1. Short duration test pulse used to minimize self-heating effect.
2012-06 2. Part mounted on FR-4 board with recommended pad layout.
WILLAS ELECTRONIC CORP.
2012-1
WILLAS ELECTRONIC CORP.
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