W3E32M72SR-XSBX Datasheet, PDF (17/19 Pages) White Electronic Designs Corporation – 32Mx72 REGISTERED DDR SDRAM

White Electronic Designs ^{W3E32M72SR-XSBX}
PACKAGE DIMENSION: 208 PLASTIC BALL GRID ARRAY (PBGA)
208 x Ø 0.60 (0.024) NOM
Bottom View
11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
1.0 (0.039) NOM
10.0 (0.394) NOM
16.1 (0.634) MAX
0.50
(0.020)
NOM
3.20 (0.126) MAX
Note: This package utilizes solder balls which contain lead. Sn63Pb37; if you require a lead-free solder ball package please contact WEDC for information.
All linear dimensions are millimeters and parenthetically in inches
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
July 2006
Rev. 3
17
White Electronic Designs Corporation • [phone] • www.wedc.com