VS-HFA25TB60SPBF Datasheet, PDF (7/8 Pages) Vishay Siliconix – Ultrafast and ultrasoft recovery

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D²PAK
Outline Dimensions
Vishay Semiconductors
DIMENSIONS in millimeters and inches
Conforms to JEDEC^® outline D²PAK (SMD-220)
(2)(3)
A
E
(3) L1
4
D
1 23
L2
BB
H
(2)
Detail A
2x e
2 x b2 C
2xb
0.010 M A M B
Lead tip
B
A
c2
(E)
A
A
c
± 0.004 M B
Gauge
plane
0° to 8°
E1
View A - A
H
L3
A1
L
L4
Detail “A”
Rotated 90 °CW
Scale: 8:1
Pad layout
11.00
(0.43)
MIN.
(D1) (3)
17.90 (0.70)
15.00 (0.625)
2.32
(0.08)
MIN.
(3)
2.64 (0.103)
2.41 (0.096)
9.65
(0.38)
MIN.
3.81
(0.15)
MIN.
Plating
(4)
b1, b3
Base
Metal
B
Seating
plane
(c)
c1 (4)
(b, b2)
Section B - B and C - C
Scale: None
SYMBOL
MILLIMETERS
MIN. MAX.
INCHES
MIN. MAX.
NOTES
SYMBOL
MILLIMETERS
MIN. MAX.
INCHES
MIN. MAX.
NOTES
A
4.06
4.83
0.160 0.190
D1
6.86
8.00
0.270 0.315
3
A1
0.00 0.254 0.000 0.010
E
9.65 10.67 0.380 0.420
2, 3
b
0.51
0.99
0.020 0.039
E1
7.90
8.80
0.311 0.346
3
b1
0.51
0.89 0.020 0.035
4
b2
1.14
1.78
0.045 0.070
e
2.54 BSC
0.100 BSC
H
14.61 15.88 0.575 0.625
b3
1.14
1.73
0.045 0.068
4
L
1.78
2.79
0.070 0.110
c
0.38
0.74
0.015 0.029
L1
-
1.65
-
0.066
3
c1
0.38
0.58
0.015 0.023
4
L2
1.27
1.78
0.050 0.070
c2
1.14
1.65
0.045 0.065
L3
0.25 BSC
0.010 BSC
D
8.51
9.65
0.335 0.380
2
L4
4.78
5.28
0.188 0.208
Notes
(1) _{Dimensioning and tolerancing per ASME Y14.5 M-1994}
(2) _{Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at}
the outmost extremes of the plastic body
(3) _{Thermal pad contour optional within dimension E, L1, D1 and E1}
(4) _{Dimension b1 and c1 apply to base metal only}
(5) _{Datum A and B to be determined at datum plane H}
(6) _{Controlling dimension: inch}
(7) _{Outline conforms to JEDEC}® _{outline TO-263AB}
Revision: 08-Jul-15
1
Document Number: 95046
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