ACAS0612_13 Datasheet, PDF (7/8 Pages) Vishay Siliconix – Precision Thin Film Chip Resistor Array

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ACAS 0612 - Precision
Vishay Beyschlag
TEST PROCEDURES AND REQUIREMENTS
EN
60 115-1
CLAUSE
IEC
60 068-2 ⁽¹⁾
TEST
METHOD
TEST
PROCEDURE
Stability for product types:
ACAS 0612
4.18.2
58 (Td)
Resistance to soldering
heat
Reflow method 2
(IR/forced gas convection);
(260 ± 5) °C;
(10 ± 1) s
4.17.2
58 (Td)
Solderability
Solder bath method;
SnPb; non-activated flux
accelerated ageing 4 h/155 °C
(215 ± 3) °C; (3 ± 0.3) s
Solder bath method;
SnAgCu; non-activated flux
accelerated ageing 4 h/155 °C
(235 ± 3) °C; (2 ± 0.2) s
REQUIREMENTS
PERMISSIBLE CHANGE ⁽²⁾
(R)
47  to 221 k
 (0.1 % R + 0.01 )
no visible damage
Good tinning ( 95 % covered);
no visible damage
4.32
21 (Ue₃)
Shear (adhesion)
45 N
No visible damage
4.33
21 (Ue₁)
Substrate bending
Depth 2 mm, 3 times
 (0.1 % R + 0.01 )
no visible damage;
no open circuit in bent position
U_RMS = U_ins
4.7
-
Voltage proof
(60 ± 5) s; against ambient,
between adjacent resistors
No flashover or breakdown
Notes
(1) _{The quoted IEC standards are also released as EN standards with the same number and identical contents.}
(2) _{Figures are given for arrays with equal values, design type AE.}
(3) _{For a single element.}
HISTORICAL TEMPERATURE COEFFICIENT AND RESISTANCE RANGES
DESCRIPTION
ACCURACY
GRADE
ABSOLUTE TCR TCR TRACKING
ABSOLUTE
TOLERANCE
TOLERANCE
MATCHING
A
± 25 ppm/K
10 ppm/K
± 0.25 %
0.1 %
RESISTANCE VALUE
ACAS 0612
47  to 221 k
B
± 25 ppm/K
10 ppm/K
± 0.5 %
0.25 %
47  to 221 k
E
± 25 ppm/K
15 ppm/K
± 0.25 %
0.1 %
47  to 221 k
F
± 25 ppm/K
15 ppm/K
± 0.5 %
0.25 %
47  to 221 k
J
± 25 ppm/K
25 ppm/K
± 0.25 %
0.1 %
47  to 221 k
K
± 25 ppm/K
25 ppm/K
± 0.5 %
0.25 %
47  to 221 k
N
± 50 ppm/K
25 ppm/K
± 0.5 %
0.5 %
47  to 221 k
P
± 50 ppm/K
50 ppm/K
± 0.5 %
0.5 %
47  to 221 k
Note
• Special temperature coefficent and resistance combinations remain available. For optimized availability please refer to the table
TEMPERATURE COEFFICENT AND RESISTANCE.
Revision: 12-Apr-13
7
Document Number: 28751
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