SI8405DB Datasheet, PDF (5/5 Pages) Vishay Siliconix – 12-V P-Channel 1.8-V (G-S) MOSFET

PACKAGE OUTLINE
MICRO FOOT: 4−BUMP (2 X 2, 0.8−mm PITCH)
4 O 0.30 X 0.31
Note 3
Solder Mask O X 0.40
e
A₂
A
A₁
e
Recommended Land
b Diamerter
E
8405
XXX
Mark on Backside of Die
NOTES (Unless Otherwise Specified):
5. Laser mark on the silicon die back, coated with a thin metal.
6. Bumps are Eutectic solder 63/57 Sn/Pb.
7. Non-solder mask defined copper landing pad.
8. The flat side of wafers is oriented at the bottom.
Si8405DB
Vishay Siliconix
Silicon
Bump Note 2
S
e
e
S
D
Document Number: 71814
S-20804—Rev. C, 01-Jul-02
Dim
A
A₁
A₂
b
D
E
e
S
MILLIMETERS*
Min
Max
0.600
0.650
0.260
0.290
0.340
0.360
0.370
0.410
1.520
1.600
1.520
1.600
0.750
0.850
0.370
0.380
INCHES
Min
Max
0.0236
0.0256
0.0102
0.0114
0.0134
0.0142
0.0146
0.0161
0.0598
0.0630
0.0598
0.0630
0.0295
0.0335
0.0146
0.0150
* Use millimeters as the primary measurement.
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