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SUM40N02-12P Datasheet, PDF (2/5 Pages) Vishay Siliconix – N-Channel 20-V (D-S) 175C MOSFET
SUM40N02-12P
Vishay Siliconix
SPECIFICATIONS (TJ =25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min Typ Max Unit
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
Drain-Source On-State Resistancea
Forward Transconductancea
Dynamicb
V(BR)DSS
VGS(th)
IGSS
IDSS
ID(on)
rDS(on)
gfs
VDS = 0 V, ID = 250 mA
VDS = VGS, ID = 250 mA
VDS = 0 V, VGS = "20 V
VDS = 20 V, VGS = 0 V
VDS = 20 V, VGS = 0 V, TJ = 125_C
VDS = 20 V, VGS = 0 V, TJ = 175_C
VDS w 5 V, VGS = 10 V
VGS = 10 V, ID = 20 A
VGS = 10 V, ID = 20 A, TJ = 125_C
VGS = 10 V, ID = 20 A, TJ = 175_C
VGS = 4.5 V, ID = 15 A
VDS = 15 V, ID = 20 A
20
0.85
2
V
3
"100
nA
1
50
mA
250
90
A
0.0095
0.012
0.0175
W
0.022
0.021
0.026
10
S
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Chargeb
Gate-Source Chargeb
Gate-Drain Chargeb
Ciss
Coss
Crss
Qg
Qgs
Qgd
VGS = 0 V, VDS = 10 V, f = 1 MHz
VDS = 10 V, VGS = 4.5 V, ID = 40 A
Gate Resistance
Turn-On Delay Timeb
Rise Timeb
Turn-Off Delay Timeb
Fall Timeb
Rg
td(on)
tr
td(off)
tf
VDD = 10 V, RL = 0.25 W
ID ^ 40 A, VGEN = 10 V, Rg = 2.5 W
Source-Drain Diode Ratings and Characteristics (TC = 25_C)c
1000
370
pF
180
7.5
12
3.5
nC
2.6
1.5
3.0
5.1
W
11
20
10
15
ns
24
35
9
15
Continuous Current
Pulsed Current
Forward Voltagea
Reverse Recovery Time
Peak Reverse Recovery Current
Reverse Recovery Charge
IS
ISM
VSD
IF = 40 A, VGS = 0 V
trr
IRM
IF = 40 A, di/dt = 100 A/ms
Qrr
40
A
90
1.1
1.5
V
20
40
ns
0.7
1.1
A
0.007
0.022
mC
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Independent of operating temperature.
c. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
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2
Document Number: 72111
S-42351—Rev. D, 20-Dec-04