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SUD17N25-165_08 Datasheet, PDF (2/5 Pages) Vishay Siliconix – N-Channel 250-V (D-S) 175 °C MOSFET
SUD17N25-165
Vishay Siliconix
New Product
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min
Typa
Max
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currentb
V(BR)DSS
VGS = 0 V, ID = 250 µA
250
VGS(th)
VDS = VGS, ID = 250 µA
2.5
IGSS
VDS = 0 V, VGS = ± 20 V
VDS = 250 V, VGS = 0 V
IDSS
VDS = 250 V, VGS = 0 V, TJ = 125 °C
VDS = 250 V, VGS = 0 V, TJ = 175 °C
ID(on)
VDS = 15 V, VGS = 10 V
17
V
4.0
± 100
nA
1
50
µA
250
A
Drain-Source On-State Resistanceb
Forward Transconductanceb
rDS(on)
gfs
VGS = 10 V, ID = 14 A
VGS = 10 V, ID = 14 A, TJ = 125 °C
VGS = 10 V, ID = 14 A, TJ = 175 °C
VDS = 15 V, ID = 17 A
0.131
0.165
0.347
Ω
0.462
36
S
Dynamica
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Chargec
Gate-Source Chargec
Ciss
Coss
Crss
Qg
Qgs
VGS = 0 V, VDS = 25 V, f = 1 MHz
VDS = 125 V, VGS = 10 V, ID = 17 A
1950
160
pF
70
30
42
10
nC
Gate-Drain Chargec
Gate Resistance
Turn-On Delay Timec
Rise Timec
Turn-Off Delay Timec
Qgd
Rg
td(on)
tr
td(off)
VDD = 125 V, RL = 7.35 Ω
ID ≅ 17 A, VGEN = 10 V, Rg = 2.5 Ω
10
1.6
Ω
15
25
130
195
ns
30
45
Fall Timec
tf
Source-Drain Diode Ratings and Characteristics (TC = 25 °C)
Pulsed Current
ISM
Diode Forward Voltageb
VSD
IF = 17 A, VGS = 0 V
100
150
20
A
0.9
1.5
V
Source-Drain Reverse Recovery Time
trr
IF = 17 A, di/dt = 100 A/µs
115
175
ns
Notes:
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 72851
S-71660-Rev. B, 06-Aug-07